Optimalisasi Aliran Udara Dalam Perakitan Komputer Untuk Mendapatkan Performa Dan Suhu Yang Optimal

Abstract

This article discusses how to optimize temperature and performance in computer assembly. In computer, temperature is  a  critical  issue  in  assembly  due the  fact  that  elevated temperatures can degrade the performance of working components, impacting their lifespan. This research evaluates various configuration setups, specifically focusing on fan placement, to efficiently channel hot air out of the computer and introduce cooler air from outside the external environment. The article employs a quantitative methodology, concentrating on data collection and analysis of temperature changes in several experiments with different configurations. The result of the analysis and comparisons indicate the precise adjustment in fan direction significantly enhance overall performance and help maintain optimal temperatures within the computer. The implications of this research can serve as a foundation for design guidelines in computer assembly. This article also provides insight for technicians, especially those  in  computer  field,  offering  advice  on  which  configurations  can  be  employed  to  manage temperature and optimize performance.